Titelmasterformat durch Klicken bearbeiten,Textmasterformate durch Klicken bearbeiten,Zweite Ebene,Dritte Ebene,Vierte Ebene,Fnfte Ebene,*,Heading Level One,First line,Second line,Third line,Fourth line,Fifth line,*,BenQ Confidential(yyyy/mm/dd),2005,BenQ Corporation,First line,Second line,Third line,Fourth line,Fifth line,*,BenQ Confidential(03/01/2006),2006,BenQ Corporation,STRICTLY CONFIDENTIAL,Click to edit Master title style,First line,Second line,Third line,Fourth line,Fifth line,*,BenQ Confidential(03/01/2006),2006,BenQ Corporation,STRICTLY CONFIDENTIAL,Click to edit Master title style,按一下以編輯母片標題樣式,按一下以編輯母片,第二層,第三層,第四層,第五層,BenQ,Confidential(2005/07/01),2005,BenQ Corporation,按一下以編輯母片標題樣式,按一下以編輯母片,第二層,第三層,第四層,第五層,BenQ,Confidential(2005/07/01),2005,BenQ Corporation,First line,Second line,Third line,Fourth line,Fifth line,*,BenQ Confidential(03/01/2006),2006,BenQ Corporation,Click to edit Master title style,First line,Second line,Third line,Fourth line,Fifth line,*,BenQ Confidential(03/01/2006),2006,BenQ Corporation,Click to edit Master title style,Heading Level One,First line,Second line,Third line,Fourth line,Fifth line,*,Titelmasterformat durch Klicken bearbeiten,Textmasterformate durch Klicken bearbeiten,Zweite Ebene,Dritte Ebene,Vierte Ebene,Fnfte Ebene,手機產品設計與開發,明基電通,移動通,訊事業群 專案管理部,產品經理,邱珮瑜,Polly Chiu,2006/12/26,Topic,個人簡介,明基,BenQ,簡介,產品開發流程,手機開發功能區塊,手機系統演進,3G,介紹,手機功能發展趨勢,無線通信發展趨勢,個人簡介,個人簡介,2000,年畢業於中山大學物理研究所,2001.042006.03:,明基儲存事業部研發處研發部,Team Leader of Write Strategy Team/Firmware R&D,Slim DVD+-R(RW)(12x)/DVD+-R(RW)(4x,8x,16x)/CDR(RW)(32x,40 x,48x)drive development,團隊發表世界第一的,4x,8x,DL,16x DVD,燒錄機,IEEE,論文發表,發表,4,篇專利,2006.032006.12:,明基移動通訊事業群專案管理部,技術產品經理,-,目前負責,3.5G HSDPA feature phone project,明基,BenQ,簡介,-,享受快樂科技,數位時尚品牌,3C,數位整合國際級設計實力,1984,年成立,企業願景,:,傳達資訊生活的真善美,1996,年股票在台灣上市,2001,年,BenQ,品牌誕生,2005,年營收,:,明基電通,:,新台幣,1,623,億元,明基集團,:,新台幣,3,979,億元,全球員工人數,(2006/10),明基電通,:13,000+,人,明基集團,:68,000+,人,量做精品,:,量身訂做讓消費者生活,充滿樂趣的網絡時尚產品,獨特,3C,產品組合：將數位產品整合成符合未來消費者生活型態的數位中樞 一,筆記型電腦、手機、數位電視,享受快樂科技之企業,化企業願景為品牌使命,1992,2002,明基集團企業願景,156,263,269,52,68,3,11,26,416,284,624,351,737,1,047,1,650,1,623,1,208,284,777,427,1,100,2,347,381,1,875,3,648,3,979,BenQ,Group,BenQ,Corp.,單位,:,億元,(,新台幣,),Phase 1,1984-1991,OEM,強大的,生產製造能力,從製造代工到深耕技術與設計之品牌,Phase 2,1991-2001,From OEM to ODM,多元化的技術投資,“水平整合,+,專業分工”,Phase 3,2001-2006,From ODM to Branded Business,數位時尚品牌,3C,數位整合,國際級設計實力,單位,:,億元,(,新台幣,),三大事業群,明基電通,移動通信,事業群,(MCG),數位媒體,事業群,(DMG),整合製造服務,事業群,(IMS),洞悉數位市場 掌握絕對優勢,獨特,5C,策略 強化競爭優勢,電子商,品,品整合,趨,趨勢贏,家,家,Computing,資訊產,品,品,個人電,腦,腦,液晶顯,示,示器,電腦週,邊,邊,ConsumerElectronics,數位媒,體,體產品,數位投,影,影機,液晶電,視,視,個人無,線,線影音,數位,相,相機,車用,顯,顯示,器,器,MobileCommunications,移動,通,通信,產,產品,行動,電,電話,產品,開,開發,流,流程,產品,開,開發,流,流程,Proposal,構想,階,階段,Plan,評估,規,規劃,階,階段,Design,設計,階,階段,Execute,研發,執,執行,階,階段,Massproduction,生產,階,階段,Close,結束,階,階段,CSystem,C1,Planning,Phase,C2,R&DDesign,Phase,C3,LabPilot,RunPhase,C4,ENGPilot,RunPhase,C5,PDPilot,RunPhase,Mass,Production,Phase,C6,C0,Proposal,Phase,Planning-PM,Manufacture,-Factory,Design-RD,Productdefinition,Feasibilityanalysis,IDinitiation,OrganizeProjectteammember,Projectschedule,HW/SWdesign,HW/SWdesignlockdown,HW/SWdesignapproved,VerificationofProductmaturityverification,Productionlinesetup,Verificationofproductionlinematurity/stability,Productdesignfinalized,Massproduction,DVTPhase,MVTPhase,QVTPhase,DVT:DesignVerificationTesting,MVT:ManufactureVerificationTesting,QVT:QualityVerificationTesting,LPR:LaboratoryPilotRun,EPR:EngineeringPilotRun,PPR:ProductionPilotRun,MP:MassProduction,MobiledevelopmentfunctionIntroduction,Mobiledevelopmentfunction,外觀,設,設計,(ID),IndustryDesign,機構,設,設計,(MD),MaterialDesign,硬體,設,設計,(HW)HardWare,BB(BaseBand,基頻,),RF(RadioFrequency,射頻,),Antenna(,天線,),軟體,設,設計,(SW)SoftWare,MMI(ManMachineInterface,人機,介,介面,),Protocol,Driver,FunctionalArchitectureofMobileToday,FeatureList-HW,Camera,Sony2.0MegaPixelCMOSAutoFocuscamera,Strobe,LEDflashlight,Display,AUO2.0”AMOLED176x220Pixels,262Kcolors,Memory,NORFlash:128Mbit,PSRAM:64Mbit,NAND:256Mbit,SDRAM:128Mbit,ExternalMemory,T-Flash,I/O,DCJack,10pinI/O,Connectivity,USB1.1,Bluetooth,ID,Vol.Up/Vol.Down,2SegmentShutterKey,ModeSwitchKey,10PinI/O,DCJack,Microphone,Receiver,T-FlashCard,MD:Appearancetreatmentdescription,A,鋁板陽極,+,噴砂,B,塑膠射出,+,噴漆,C,塑膠射出,+,噴漆,D,塑膠射出,+,噴漆,E,平板背印,F,P+R,噴塗雷雕,G,H,雙料射出,+,噴漆,I,RUBBER,J,電鍍,K,電鍍,L,玻璃背印,M,塑膠射出,+,背印,N,銘版髮絲處理,P,Q,噴漆,Explodeddrawing,1,2,3,5,8,10,7,9,6,11,12,4,15,13,14,17,16,Frontcaseassy.,Keypadassy.,Mainlens,Joystickcap,OLEDmodule,Receiver,KeypadFPC,MainPCBassy.,DSCmodule,DSCFPC,DSCholder,Speaker,Vibrator,Rearcaseassy.,Antennacover,Batterycover.,Batterypack.,Placementdescription-I,Shieldingcase1-BB,Shieldingcase2-BB,T-flashconnector,(push-pushtype),Pogopin(forESD),Back-upbattery,(Capacitor),30pinBTBConn.,(forDSCmodule),Joystick,(Mitsumi),SMT-typeMIC,Placementdescription-II,I/Oconnector,Batteryconnector,Modeswitch,BTantennaswitch,DCjack,Antennaconnector,Antennaswitch,Side-key(Vol-key),RFshieldingcase,10pinConn.,(Spk.andflash),LCMconnector,BBshieldingcase,SIMconnector,KeyFPCc。